- Dry Etching System
The Reactive Ion Etch system with a vacuum loadlock. The Loadlock allows the main chamber to continue pumping whilst a sample is loaded, or unloaded, and is ideal for toxic gas chemistries.
- PECVD System
The Orion Plasma Enhanced Chemical Vapor Deposition System produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
- Stripper System
The Apollo Stripper can be configured for a 200mm or 300mm Chuck. By employing RF bias power, difficult to remove layers of resist can be removed at low temperatures.
- Etch rates up to 6um/min
- High throughput
- Low plasma damage
- Automatic tuning
- 100mm to 300mm wafers